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Quality guaranteed We sell only warrantied and traceable partsIf you have been searching for 205-0059-001 of Microcircuit Assemb components with NSN 5962013566553 under FSC 5962 Microcircuits Electronic, look no further than Limitless Aerospace. 205-0059-001 part is listed alongside the other Microcircuit Assemb parts, and it has been manufactured by Dpac Technologies Corp (CAGE Code 66847). With current availability through our website, we invite you to request a quick and competitive quote for 205-0059-001 by filling out and submitting the RFQ form below. By providing us with information such as your target price and when you need your parts by, we can ensure that we offer a personalized solution that accommodates your individual needs and requirements.
NSN parts are those that follow the NSN system as dictated by the NATO Standardization Agreements, and they contain a 13-digit serial number to optimize the procurement, stocking, and issuing of items through the federal supply system. On Limitless Aerospace, we make finding the NSN parts and components you need easy, and customers may peruse our robust NSN part catalogues or use our search engine to find specific items with ease. As the only independent distributor with a no China sourcing pledge, we choose to only stock items from top global manufacturers such as Dpac Technologies Corp. Get started on the purchasing process for 205-0059-001 today and see how we can serve as your strategic sourcing partner for all of your operational needs.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-356-6553 Item Description: Microcircuit Assemb | 5962 | 013566553 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 205-0059-001 | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.999 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.999 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.170 INCHES NOMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND RADIATION HARDENED AND STATIC OPERATION |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEM | MICROCIRCUIT DEVICE TYPE AND QUANTITY | 4 MEMORY |
| FEAT | SPECIAL FEATURES | NUCLEAR HARDNESS CRITICAL ITEMS |
| NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 31 PIN |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CZER | MEMORY DEVICE TYPE | RAM |
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